| 01 | Optical engine integrator | Integrates photonic and electronic components into an optical engine intended for close placement to a switch or compute ASIC. | CPO or NPO systems requiring optical I/O near high-speed electrical processing. | Optical lane configuration, power and thermal design, electrical interface, test coverage, and integration responsibilities. |
| 02 | Silicon photonics platform provider | Provides photonic integrated circuit design and manufacturing services, which may include waveguides, modulators, and photodetectors. | Custom optical engines and transceiver designs based on silicon photonics. | Process design kit availability, supported wavelengths, design rules, wafer access, and production qualification. |
| 03 | InP photonics component supplier | Supplies indium phosphide-based active photonic components, such as laser or gain devices, subject to the supplier’s product portfolio. | Optical links that require integrated or externally coupled light sources. | Output and wavelength requirements, coupling method, reliability data, operating conditions, and supply continuity. |
| 04 | Fiber array unit specialist | Builds fiber array units that align multiple optical fibers with photonic interfaces for optical coupling. | Fiber attachment to photonic integrated circuits, optical engines, or related packages. | Fiber count and pitch, alignment tolerances, end-face quality, optical loss, attachment method, and inspection criteria. |
| 05 | Precision fiber-attach provider | Offers active or passive fiber alignment and attachment processes for optical assemblies. | Prototype and production assembly where repeatable fiber-to-chip coupling is required. | Alignment strategy, process repeatability, rework policy, measured coupling loss, and assembly yield reporting. |
| 06 | Advanced optical packaging house | Packages photonic devices using processes such as die attach, wire bonding or flip-chip assembly, sealing, and optical coupling. | Optical engine packaging and photonic device builds that need specialized assembly capabilities. | Supported package formats, materials, thermal path, cleanliness controls, traceability, and qualification standards. |
| 07 | Co-packaged optics assembly partner | Supports assembly of optical engines alongside switching or compute silicon within a shared package or system-level assembly. | CPO development programs and manufacturing ramps involving close optical-electrical integration. | Package integration flow, known-good-die strategy, optical test access, thermal management, and yield ownership. |
| 08 | Near-packaged optics module supplier | Provides optical module or engine designs intended to sit near, rather than within, the main ASIC package. | NPO architectures seeking shorter electrical connections while retaining a distinct optical assembly. | Host interface compatibility, placement and cabling needs, serviceability, power budget, and system-level interoperability. |
| 09 | Optical test and metrology provider | Supplies test services or equipment for measuring optical power, wavelength, insertion loss, alignment, and related characteristics. | FAU, optical engine, and photonic package development or production inspection. | Measurement uncertainty, calibration traceability, test throughput, automation interfaces, and data-recording format. |
| 10 | Fiber and interconnect component supplier | Supplies optical fiber, fiber ribbons, connectors, or related interconnect components used in optical assemblies. | External fiber routing and interconnects for CPO, NPO, and other optical systems. | Fiber type, connector compatibility, bend and routing requirements, environmental limits, and availability of documented specifications. |